MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To reduce deterioration in high frequency property of a multilayer wiring substrate. SOLUTION: N sheets of (N is an integer of 2 or more) wiring boards wherein a conductor wiring 2 is disposed on the surface of an insulating board 1 are laminated on a multilayer wiring board. The permittivity of Mth laminated wiring board (M is any integer from 2 to N) is small because a specified position of an insulating board is opened, resulting suppressing deterioration of high frequency property. In addition, the multilayer wiring board is small in signal delay compared with surface mounting by providing a chip function device 5 in an opening 4 of the Mth layer.