| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition that has high wettability and attains high adhesion to a variety of adherend as well as shows excellent hygrothermal resistance despite of an adhesion temperature of <=200 deg.C and low thermal expansion. SOLUTION: The adhesive composition comprises a polycarbodiimide resin, phenoxy resin and silane-coupling agent. In a preferred embodiment, an aromatic polycarbodiimide is used and the silane compound is preferably the one represented by formula (A), (B) and (C).
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