发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To enhance the heat-resistant stability of a polyamide-base photosensitive resin printing plate material. SOLUTION: The photosensitive resin composition contains (A) a soluble polyamide resin, (B) a photopolymerizable unsaturated compound having ethylenic double bonds at the terminals, (C) a photopolymerization initiator, (D) a naphthoquinone derivative of formula (1) and/or (2) and (E) an N- nitrosohydroxylamine derivative of formula (3).
申请公布号 JP2002333706(A) 申请公布日期 2002.11.22
申请号 JP20010137741 申请日期 2001.05.08
申请人 TOYOBO CO LTD 发明人 HIRAMATSU TOMONORI;TAGUCHI YUJI
分类号 G03F7/004;C08F2/44;C08F283/04;C08K5/17;C08K5/32;C08K5/42;C08K5/435;C08L77/00;G03F7/00;G03F7/027;G03F7/028;G03F7/037 主分类号 G03F7/004
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