| 摘要 |
A polishing slurry for chemical-mechanical polishing, containing 5 to 50% by weight of a colloidal silica abrasive, and from about 0.1 to about 10% by weight of a quaternary ammonium salt which is represented by the formula R4N+X-, where R may be identical or different and is selected from the group consisting of alkyl, alkenyl, alkylaryl, arylalkyl and an ester group, and X is hydroxyl or halogen, is distinguished by a high polishing rate.
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