| 摘要 |
A method for laser drilling in a material for use in production of printed circuits is disclosed. The material is produced in a process comprising electroplating a layer of copper or copper alloy onto a foil of aluminium or aluminium alloy, said foil having one surface prepared for said electroplating, lamination by means of heat and pressure said copper plated aluminium foil onto at least one side of an insulating prepreg base of thermosetting, optionally fibre reinforced, plastics with copper layer facing said base, alkaline etching of said aluminium and acidic removal of residues not dissolvable in alkalines. The method for laser drilling is characterised in that said laser drilling is performed before said acidic removal, whereby said residues are used as absorbant for laser energy in said laser drilling. |
