发明名称 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE
摘要 A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
申请公布号 WO02093991(A1) 申请公布日期 2002.11.21
申请号 WO2002IB01225 申请日期 2002.04.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;DELAMARCHE, EMMANUEL;FLAKE, JOHN, C.;GEISSLER, MATTHIAS;GRAHAM, WILLIAM, S.;MAGNUSON, ROY, H.;MICHEL, BRUNO;SCHMID, HEINZ 发明人 DELAMARCHE, EMMANUEL;FLAKE, JOHN, C.;GEISSLER, MATTHIAS;GRAHAM, WILLIAM, S.;MAGNUSON, ROY, H.;MICHEL, BRUNO;SCHMID, HEINZ
分类号 C23C18/16;C23C18/18;H01L21/48;H05K3/00;H05K3/06;H05K3/18;H05K3/38 主分类号 C23C18/16
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