Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor

摘要

A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die (40) on the substrate (300) with bumps (45) abutting upper surfaces (310) of the raised terminal portions (305), and reflowing the assembly. During the reflow process, the raised terminal portions (305) and the bumps (45) melt and displace the filler (27) in the underfill compound (5) away from between the bumps (45) and the raised terminal portions (305). This prevents the filler (27) from forming a barrier. The molten solder forms interconnects between the pads (46) and the raised terminal portions (305).