发明名称 |
Semiconductor processing component |
摘要 |
A semiconductor processing component includes a quartz body characterized by silicon oxide filled micro cracks. The component is utilized as a processing component in a semiconductor furnace system. The quartz body is prepared by cleaning the component to remove a build up silicon layer and to expose micro cracks in the surface of the component and to etch the micro cracks into trenches. A silicon layer is applied onto the processing component body and at least a portion of the silicon is oxidized to silica to fill the trenches in the surface of the component body.
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申请公布号 |
US2002173117(A1) |
申请公布日期 |
2002.11.21 |
申请号 |
US20020199273 |
申请日期 |
2002.07.22 |
申请人 |
GORCZYCA THOMAS BERT;LAZZERI MARGARET ELLEN;AHLGREN FREDERIC FRANCIS |
发明人 |
GORCZYCA THOMAS BERT;LAZZERI MARGARET ELLEN;AHLGREN FREDERIC FRANCIS |
分类号 |
H01L21/306;H01L21/762;(IPC1-7):H01L21/823;H01L21/336;H01L21/76;H01L29/00 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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