发明名称 CMOS STRUCTURE WITH MAXIMIZED ACTIVATION OF THE POLYSILICON GATE DOPANT AND METHOD OF MANUFACTURING THE SAME
摘要 A method for manufacturing a semiconductor device, comprising the steps of: forming a gate electrode (13) on a main surface of a semiconductor substrate (10) with a gate oxide layer (12) therebetween; forming source/drain regions (18) in portions of the main surface adjacent to the gate electrode; and characterised by the following step of: selectively doping the gate electrode and the source/drain regions, so that the gate electrode has an impurity concentration higher than that of the source/drain regions.
申请公布号 WO02093636(A1) 申请公布日期 2002.11.21
申请号 WO2002GB01926 申请日期 2002.04.25
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED 发明人 PARK, HEEMYONG;SCHEPIS, DOMINIC, JOSEPH;ASSADERAGHI, FARIBORZ
分类号 H01L21/336;H01L21/8238;(IPC1-7):H01L21/336;H01L21/823 主分类号 H01L21/336
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