发明名称 |
CMOS STRUCTURE WITH MAXIMIZED ACTIVATION OF THE POLYSILICON GATE DOPANT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A method for manufacturing a semiconductor device, comprising the steps of: forming a gate electrode (13) on a main surface of a semiconductor substrate (10) with a gate oxide layer (12) therebetween; forming source/drain regions (18) in portions of the main surface adjacent to the gate electrode; and characterised by the following step of: selectively doping the gate electrode and the source/drain regions, so that the gate electrode has an impurity concentration higher than that of the source/drain regions.
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申请公布号 |
WO02093636(A1) |
申请公布日期 |
2002.11.21 |
申请号 |
WO2002GB01926 |
申请日期 |
2002.04.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED |
发明人 |
PARK, HEEMYONG;SCHEPIS, DOMINIC, JOSEPH;ASSADERAGHI, FARIBORZ |
分类号 |
H01L21/336;H01L21/8238;(IPC1-7):H01L21/336;H01L21/823 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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