发明名称 METHOD AND DEVICE FOR LASER BEAM MACHINING OF LAMINATED MATERIAL
摘要 A method for laser beam machining of a laminated material capable of machining a laminated material (1) comprising one or more conductive layers (4, 6) and an insulating layer (2) laminated each other by a laser beam (20), comprising the steps of radiating the laser beam (20) to the laminated material to form a hole (22) for machining the conductive layer (4) and radiating the laser beam smaller in beam diameter at a machining point than the laser beam radiated to the conductive layer (4) into the hole (22) to machine the insulating layer (2) laminated on the conductive layers (4, 6).
申请公布号 WO02092276(A1) 申请公布日期 2002.11.21
申请号 WO2002JP03150 申请日期 2002.03.29
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA;KOBAYASHI, NOBUTAKA;TAKENO, SHOZUI;ITO, KENJI;MORIYASU, MASAHARU 发明人 KOBAYASHI, NOBUTAKA;TAKENO, SHOZUI;ITO, KENJI;MORIYASU, MASAHARU
分类号 B23K26/382;B23K26/402;H05K1/03;H05K3/00 主分类号 B23K26/382
代理机构 代理人
主权项
地址