Production of a wafer having a surface with recesses partially filled with a protective layer comprises applying the protective layer on the wafer so that the recesses

摘要

Production of a wafer (1) having a surface with recesses (2) partially filled with a protective layer (3) comprises applying the protective layer on the wafer so that the recesses are filled with the material of the protective layer; removing the protective layer up to the surface of the wafer and determining for a first time period; and continuing the removal process for a second time period until the protective layer is removed within the recess. An Independent claim is also included for a device for producing the wafer. Preferred Features: The second time period is determined by multiplying the first time period with the ratio of the required depth (5) to the starting thickness (4). The ratio of the removal speeds for the protective layer is constant during the first and second time periods. The protective layer is a protective lacquer.