PACKAGE LEVEL PRE-APPLIED UNDERFILLS FOR THERMO-MECHANICAL RELIABILITY ENHANCEMENTS OF ELECTRONIC ASSEMBLIES
摘要
Surface mount packages (70) having pre-applied underfill (50) thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.
申请公布号
WO02093595(A2)
申请公布日期
2002.11.21
申请号
WO2002IB01462
申请日期
2002.05.01
申请人
NOKIA CORPORATION;HANNAN, NAEL;PULIGANDLA, VISWANADHAM;DUNFORD, STEVEN, O.;RAUTILA, PEKKA
发明人
HANNAN, NAEL;PULIGANDLA, VISWANADHAM;DUNFORD, STEVEN, O.;RAUTILA, PEKKA