A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference ("EMI"). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.
申请公布号
WO0225732(A3)
申请公布日期
2002.11.21
申请号
WO2001US29503
申请日期
2001.09.20
申请人
BALLARD POWER SYSTEMS CORPORATION;PARKHILL, SCOTT;AHMED, SAYEED;FLETT, FRED;MALY, DOUGLAS
发明人
PARKHILL, SCOTT;AHMED, SAYEED;FLETT, FRED;MALY, DOUGLAS