发明名称 Wärmeableitende Abstandhalter für elektronische Einrichtungen
摘要 <p>A heat dissipating spacer consisting of a silicone composition comprising from 55 to 95 vol% of a two-part addition reactive silicone and from 5 to 45 vol% of a heat conductive filler, the solidified product of the silicone composition having a thermal conductivity of at least 0.8 W/m.K and a compressibility of at least 10% under a load of 30 g/cm<2>.</p>
申请公布号 DE69709978(T2) 申请公布日期 2002.11.21
申请号 DE1997609978T 申请日期 1997.04.29
申请人 DENKI KAGAKU KOGYO K.K., TOKIO/TOKYO 发明人 SAWA, HIROAKI;NISHIKAWA, MASATO;SATO, MIKITOSHI;IKEDA, KAZUYOSHI
分类号 H01L23/373;(IPC1-7):H05K7/20;H01L23/367;H01L23/34 主分类号 H01L23/373
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