发明名称 |
Wärmeableitende Abstandhalter für elektronische Einrichtungen |
摘要 |
<p>A heat dissipating spacer consisting of a silicone composition comprising from 55 to 95 vol% of a two-part addition reactive silicone and from 5 to 45 vol% of a heat conductive filler, the solidified product of the silicone composition having a thermal conductivity of at least 0.8 W/m.K and a compressibility of at least 10% under a load of 30 g/cm<2>.</p> |
申请公布号 |
DE69709978(T2) |
申请公布日期 |
2002.11.21 |
申请号 |
DE1997609978T |
申请日期 |
1997.04.29 |
申请人 |
DENKI KAGAKU KOGYO K.K., TOKIO/TOKYO |
发明人 |
SAWA, HIROAKI;NISHIKAWA, MASATO;SATO, MIKITOSHI;IKEDA, KAZUYOSHI |
分类号 |
H01L23/373;(IPC1-7):H05K7/20;H01L23/367;H01L23/34 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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