| 摘要 |
A multilayer substrate for a buildup with a via, which multilayer substrate comprises a base material comprising an insulation resin layer on which a predetermined hole is formed, wherein an electrodeposition layer is formed by circular oscillation electroplating on the inside wall surface of the hole and on the predetermined surface of the insulation resin layer, the electrodeposition layer on the inside wall surface of the hole being formed in a thickness greater than the electrodeposition layer formed on the surface of the insulation resin layer and a method for the production of the substrate.
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