| 摘要 |
A plate 2 with a photodiode PD is positioned with a slight interval with respect to a housing 1, a small amount of an ultraviolet curing adhesive 8a is applied to four portions each located between a corner of either side edge 2a of the plate 2 and the housing 1, the ultraviolet curing adhesive 8a is allowed to cure by application of ultraviolet rays thereto to temporarily fix the plate 2 to the housing 1, an appropriate amount of a thermosetting adhesive is applied to two portions each located between a central portion of either side edge 2a of the plate 2 and the housing 1, and the thermosetting adhesive 8b is allowed to cure by heating so as to finally fix the plate 2 to the housing 1.
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