发明名称 |
Chemical Mechanical polishing apparatus |
摘要 |
A chemical mechanical polishing apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, a washer having a cleaning device; and a dresser. The dresser comprises a bottom disk contacting the polishing pad. The dresser can move between the polishing pad and the washer. When the dresser moves into the washer, a diamond zone on the bottom disk cleans the polishing pad, and the cleaning device cleans the diamond zone.
|
申请公布号 |
US2002173254(A1) |
申请公布日期 |
2002.11.21 |
申请号 |
US20020053164 |
申请日期 |
2002.01.15 |
申请人 |
NANYA TECHNOLOGY CORPORATION |
发明人 |
LIU LI-CHUNG;CHANG CHING-HUNG;LIN CHUNG-MIN |
分类号 |
B08B1/00;B08B3/10;B08B3/12;B24B37/04;B24B53/12;H01L21/00;(IPC1-7):B24B1/00;B24B47/26;B24B55/00 |
主分类号 |
B08B1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|