| 摘要 |
Methods and apparatus for planarizing a substrate surface having copper containing materials thereon is provided. In one aspect, the invention provides a method for polishing a substrate including polishing the substrate with an abrasive-free polishing pad until it is substantially planarized and then polishing the substrate with a fixed abrasive polishing pad to remove residual materials disposed thereon. Another aspect of the invention provides a computer readable medium bearing instructions for performing the method described herein. In another aspect, the invention provides a system for processing substrates including a first platen, an abrasive-free polishing pad disposed on the first platen, a second platen, a fixed abrasive polishing pad disposed on the second platen, and a computer based controller configured to cause the system to polish the substrate with an abrasive-free polishing pad; and then to polish the substrate with a fixed abrasive polishing pad to remove residual materials disposed thereon.
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