PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A printed circuit board for semiconductor package is provided to protect an IC(Integrated Circuit) of a semiconductor chip by preventing static electricity generated between a worker and the printed circuit board. CONSTITUTION: A plurality of package units are formed on a printed circuit board. A plurality of semiconductor chips is mounted on a chip pad portion of the package unit. The package unit has a sealing portion(9), a plurality of conductive patterns(22), and a plurality of via holes. The sealing portion(9) is used for sealing a contact pad of the semiconductor chip and a bond finger. The conductive patterns(22) are extended from the bond finger to an outline of a printed circuit board. The via hole is installed at the conductive pattern(22) in order to connect the conductive patterns(22) with each other. The conductive pattern(22) is formed with a center pattern part(222) and an outline pattern part(224).