发明名称 |
FABRICATION OF THERMOELECTRIC MODULES AND SOLDER FOR SUCH FABRICATION |
摘要 |
A thermoelectric module is formed with a solder joint, the solder containing about 50 to 99 weight percent bismuth and about 50 to 1 weight percent antimony, between the thermoelectric elements and the connecting conductors. Also provided is a thermoelectric module having bismuth telluride elements coated with a conductive material that does not require a nickel or other diffusion barrier. Further provided are modules having conductors with a phosphorus-nickel surface. Methods of manufacturing and using such thermoelectric modules are further provided. |
申请公布号 |
EP0870337(B1) |
申请公布日期 |
2002.11.20 |
申请号 |
EP19960936249 |
申请日期 |
1996.09.30 |
申请人 |
MELCOR CORPORATION |
发明人 |
YAHATZ, MICHAEL;HARPER, JAMES |
分类号 |
H01L35/32;H01L;H01L35/08;H01L35/10;H01L35/34 |
主分类号 |
H01L35/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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