| 摘要 |
An angle-mounted tan sink for an electronic device, such as the processor of a computer system, or the like includes a heat sink coupled to a surface of the electronic device for conducting heat away from the electronic device. A fan assembly is mounted in an oblique orientation to the base of the heat sink. The fan assembly circulates a cooling medium such as air over the heat sink at an angle that is generally oblique to the surface of the electronic device for dissipating heat from the heat sink. <IMAGE> |
