| 摘要 |
FIELD: three- dimensional electronic modules with chip components. SUBSTANCE: chip components are disposed in windows of group ceramic blank over outline so that active areas of components and blank are arranged in common plane. Components are locked in this position, their electrically unprotected areas are insulated on face side. Then conductors are deposited on face and back sides of blank and components primarily by vacuum evaporation at the same time forming connector and connecting leads required for thermal-electric aging and inspection. Finished integrated-circuit boards are cut out of group blank and assembled in stack where they are joined together by capillary soldering. Heat sink with external leads is soldered to one of stack edges, and finished module is encapsulated. EFFECT: enhanced packing density and heat transfer efficiency; reduced cost. 12 cl, 9 dwg
|
