| 发明名称 |
Laser beam system for micro via formation |
| 摘要 |
A laser system for micro via formation directly over a plated through hole (PTH). The laser system forms the micro via directly over the PTH with full dielectric removal from a capture pad while minimizing the dielectric removal from a center portion of the PTH. |
| 申请公布号 |
US6483074(B2) |
申请公布日期 |
2002.11.19 |
| 申请号 |
US20010802054 |
申请日期 |
2001.03.07 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KRESGE JOHN S. |
| 分类号 |
B23K26/073;B23K26/38;H05K3/00;H05K3/46;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/073 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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