发明名称 MOLD RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a mold release film having excellent characteristics when used as a carrier film in a step of molding an anisotropic conductive film having adhesive properties or when used as a separator at the time of winding. SOLUTION: The mold release film comprises a mold release layer A formed on one side surface of a polyester film, and a mold release layer B provided on the other surface. The mold release film is used as the carrier film in the step of molding the anisotropic conductive film having the adhesive properties, and as the separator at the time of winding. The centerline mean roughness and a release force of each of the surfaces of the layers A and B are in specific ranges. The overall light ray permeability and the haze value of the mold release film are in specific ranges.
申请公布号 JP2002331614(A) 申请公布日期 2002.11.19
申请号 JP20010138400 申请日期 2001.05.09
申请人 TEIJIN LTD 发明人 MORIMOTO SACHIRO
分类号 B32B27/00;B32B7/02;B32B27/36;(IPC1-7):B32B27/00 主分类号 B32B27/00
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