发明名称 |
Wiring board and semiconductor device using the same |
摘要 |
A wiring board according to the present invention has a substrate, a plurality of lines provided on the substrate, an interference-preventive conductor layer provided between the lines to have open ends and prevent signal interference between the lines, and a via electrically connected to the interference-preventive conductor layer. The via is provided at a point at which a distance from each of the open ends of the interference-preventive conductor layer is less than one quarter of a wavelength corresponding to a maximum frequency component of harmonic components contained in the signal.
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申请公布号 |
US6483175(B2) |
申请公布日期 |
2002.11.19 |
申请号 |
US20010953270 |
申请日期 |
2001.09.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YOSHIDA TAKAYUKI |
分类号 |
H01L23/12;H01L21/60;(IPC1-7):H01L23/62;H01L23/34;H01L23/48;H01L23/52;H01L23/495;H01L29/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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