发明名称 |
Package and method of manufacturing the same |
摘要 |
The present invention provides a package whose heat dissipation performance by a semiconductor device has been improved, which synchronizes with the rapid development of high transmission density in multiplex communications. In place of the conventional package substrate, a substrate formed by a combination of two or more kinds of materials is used, whereby the temperature of a portion at which the temperature tends to rise to become extremely high within the package is selectively dissipated, whereby the heat dissipation performance of the package is efficiently improved. A diamond coated substrate or diamond substrate is used at a portion with an extremely high temperature for dissipating the heat.
|
申请公布号 |
US6483040(B2) |
申请公布日期 |
2002.11.19 |
申请号 |
US20010789581 |
申请日期 |
2001.02.22 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OOE SATOSHI;YAMAMOTO YOSHIYUKI |
分类号 |
H01L23/12;H01L23/08;H01L23/36;H01L23/373;H01L23/498;(IPC1-7):H05K1/03 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|