发明名称 |
Composition and method for dissipating heat |
摘要 |
A composition for increasing the dissipation of heat from one portion of a surface when heat is applied to another portion of the same surface. The preferred composition is a gel or paste with high water content and a thickener of a mineral clay in a colloidal suspension. The invention finds particular use in welding and soldering processes which are carried out adjacent heat sensitive materials.
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申请公布号 |
US6482473(B1) |
申请公布日期 |
2002.11.19 |
申请号 |
US20000716487 |
申请日期 |
2000.11.20 |
申请人 |
HALLO KENNETH R.;SHELD JOHN L. |
发明人 |
HALLO KENNETH R.;SHELD JOHN L. |
分类号 |
B23K35/22;C21D1/70;(IPC1-7):B05D3/00 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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