发明名称 Composition and method for dissipating heat
摘要 A composition for increasing the dissipation of heat from one portion of a surface when heat is applied to another portion of the same surface. The preferred composition is a gel or paste with high water content and a thickener of a mineral clay in a colloidal suspension. The invention finds particular use in welding and soldering processes which are carried out adjacent heat sensitive materials.
申请公布号 US6482473(B1) 申请公布日期 2002.11.19
申请号 US20000716487 申请日期 2000.11.20
申请人 HALLO KENNETH R.;SHELD JOHN L. 发明人 HALLO KENNETH R.;SHELD JOHN L.
分类号 B23K35/22;C21D1/70;(IPC1-7):B05D3/00 主分类号 B23K35/22
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