发明名称 Wiring board manufacture method, wiring board, and electrical connection box
摘要 A method of manufacturing a wiring board comprising the steps of winding an electrical wire around a insulating plate having a number of electrical wire grooves for placing an electrical wire therein and a number of terminal grooves formed at positions corresponding to the electrical wire grooves in which the attached pressure connection terminal is connected to the electrical wire making use of the electrical wire grooves; cutting the electrical wire wound around the insulating plate at desired positions; and attaching the pressure connection terminal at a desired position in the number of terminal grooves, a wiring board, and an electrical connection box manufactured by accommodating the wiring box in a casing.
申请公布号 US6481100(B2) 申请公布日期 2002.11.19
申请号 US20010771401 申请日期 2001.01.26
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 MURAKAMI MASAKAZU;TANAKA MITSUO;SATORI TATSUO
分类号 H02G3/16;H05K1/00;(IPC1-7):H01K3/10;H01R43/033 主分类号 H02G3/16
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