发明名称 |
Multilayer flexible FR4 circuit |
摘要 |
A flexible circuit (100) includes a first circuit path portion (110) and a second rigid circuit path portion (140) to which electronic components (102) may be coupled. Each circuit path portion (110 and 140) including a resin layer (112 and 142) and an adjacent conductive layer (114 and 144). Each circuit path portion (110 and 140) defining a gap (120 and 150) substantially running along a line corresponding to a desired bend location. A central circuit path portion (130) is disposed between the first circuit path portion (110) and the second rigid circuit path portion (140) and includes a first conductive layer (134) in electrical communication with the first circuit path portion (110) and a second conductive layer (136) in electrical communication with the second rigid circuit path portion (140), so as to provide electrical communication across the gaps (120 and 150). A metal plate (160) is disposed adjacent the second rigid circuit path portion (140).
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申请公布号 |
US6483037(B1) |
申请公布日期 |
2002.11.19 |
申请号 |
US20010008422 |
申请日期 |
2001.11.13 |
申请人 |
MOTOROLA, INC. |
发明人 |
MOORE KEVIN D.;GALL THOMAS P. |
分类号 |
H05K1/00;H05K1/03;H05K3/00;H05K3/28;(IPC1-7):H05K1/09 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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