Electronic component with shield case and method for manufacturing the same

摘要

The present invention provides a method for manufacturing a highly reliable electronic component in which the shield case is securely fixed to a substrate without requiring a step for filling a solder paste in engaging holes, and a highly reliable electronic component with a shield case manufactured by the method, wherein engaging pins of the shield case are inserted into the engaging holes of the mother substrate, reflow soldering is applied when the solder paste is coated on the circumference of the engaging holes as well as on the area including the circumference of the engaging hole and at least a part of the engaging hole at the reversed face (back face) of the component mounting face covered with the shield case of the mother substrate, and mother substrate is divided into individual electronic component with the shield case after soldering the engaging pins of the shield case to the case fixing electrodes disposed on the circumference face of the engaging holes.