| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a recovering device of an abrasive to be reused by efficiently recovering abrasive particles from a waste liquid including the abrasive discharged from a CMP process used in a semiconductor manufacturing factory. SOLUTION: This device recovers the abrasive from the waste liquid of the CMP process of using silica slurry. This recovering device of the abrasive is characterized by having a membrane separating means for introducing the waste liquid, a cleaning means of a concentrated liquid obtained by the membrane separating means, and an adjusting means for adjusting pH of the cleaned concentrated liquid.</p> |
