发明名称 |
Nonconductive laminate for coupling substrates and method therefor |
摘要 |
An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.
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申请公布号 |
US6482289(B1) |
申请公布日期 |
2002.11.19 |
申请号 |
US19950540139 |
申请日期 |
1995.10.06 |
申请人 |
MOTOROLA, INC. |
发明人 |
FANG TRELIANT;GRUPEN-SHEMANSKY MELISSA E.;KUO SHUN-MEEN |
分类号 |
H01L21/60;H05K3/32;H05K3/40;(IPC1-7):B32B31/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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