| 摘要 |
An IC-incorporating card has a grounding structure which ensures reliable grounding of metal panels thereof and employs a connector which is usable in common for cards having different thicknesses. The card includes a board mounted with an integrated circuit, a resin frame defining an internal space for accommodating the board, first and second metal panels attached to the resin frame to define the internal space, a connector mounted on the board, and a grounding structure for grounding the first and second metal panels. The connector has first and second grounding conductor elements. The first metal panel is connected to the first grounding conductor element via a grounding connection element embedded in the resin frame. The second metal panel is directly connected to the second grounding conductor element.
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