| 摘要 |
<p>PURPOSE:To provide an aligning method for semiconductor wafer and a glass mask therefor being employed in an excellent aligner where the rotational angle of the orientation flat of a semiconductor wafer can be detected on a wafer chuck for performing exposure nullified strictly. CONSTITUTION:A glass mask 11 provided with one or a plurality of slits except the device forming region is set in an aligner. The glass mask 11 is provided with a pattern 14 for aligning the orientation flat of a semiconductor wafer and the long side of the pattern is limited not to exceed the length of orientation flat at the time of projection onto the semiconductor wafer to be exposed. Variation in the shape or intensity of the light reflected on the orientation flat of the semiconductor wafer is determined when the semiconductor wafer is shifted. The deviation from the direction of orientation flat of the semiconductor wafer and the direction of slit in the glass mask 11 is then reduced based on the variation thus determined.</p> |
