| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for easily forming a bump on the pad of a work where an oxide film is removed. SOLUTION: An oxide film 2' formed when the pads 2 of a work 1 come into contact with air is removed by plasma etching, then a metal film 6 is formed on the upside of the work 1, and a solder 7 wider than the pad 2 in area is formed on each of the pads 2. Then, the work 1 is heated through a reflow oven, whereby the solders 7 are melted and formed into hemispherical bumps 7' on the pads 2 through surface tension, and the metal film 6 coming into contact with the solders 7 is melted into molten solder, so that the bumps 7 of alloy of solder and metal contained in the metal film 6 are formed. A cut part 8 is induced between the bump 7' and the metal film 6 on the upside of the work 1, so that the bump 7' is restrained from being electrically connected to the metal film 6 on the work 1.</p> |
