POWER SEMICONDUCTOR DEVICE HAVING CHIP-ON-CHIP STRUCTURE

摘要

PURPOSE: A power semiconductor device having a chip-on-chip structure is provided to miniaturize a size of the power semiconductor device, improve reliability of the power semiconductor device, and lower a production cost of the power semiconductor device by using the chip-on-chip structure. CONSTITUTION: A lead frame(108) is used for fabricating a semiconductor package. A conductive adhesive(106) is applied on an upper face of a chip pad of the lead frame(108). A semiconductor chip(100) for power is adhered on the upper face of the chip pad of the lead frame(108). A passivation layer is not formed on the upper portion of the semiconductor chip(100). An insulating adhesion layer(102A) is covered on a surface of the semiconductor chip(100) for power. An IC(Integrated Circuit) chip(104) for control is adhered on a surface of the insulating adhesion layer(102A).