| 摘要 |
PURPOSE: A package mounting apparatus is provided to improve a reliability of a solder joint by using a solder structure having hourglass shape. CONSTITUTION: The package mounting apparatus comprises a PCB(Printed Circuit Board) substrate(40), a micro lifter(30), a BGA(Ball Grid Array) package(50), and a solder paste(41). The micro lifter(30) further includes a cylinder and a lifting pin. The solder paste(41) is coated on the PCB substrate(40) and the micro lifter(30) is attached on the PCB substrate(40). After loading the BGA package(50) having spherical solder balls(51a) on the solder paste(41), a reflow processing is performed. At this time, the lifting pin of the micro lifter(30) is raised up by air expansion, thereby raising the BGA package(50). As a result, the spherical solder balls(51a) is changed to an hourglass shaped solder ball.
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