CURABLE RESIN COMPOSITION

摘要

The present invention is to provide a curable resin composition comprising (I) a reactive silicon group-containing polyoxyalkylene polymer wherein a introduction rate of a reactive silicon group into molecular chain terminus is not less than 85% as analyzed by <1>H-NMR spectrometry and (II) an epoxy resin. The curable resin obtained from this composition reflects improvements in tensile strength and tensile shear bond strength and in adhesion to various substrates.