SINGULATION METHOD OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE WHICH IS MANUFACTURED BY FLEXIBLE CIRCUIT BOARD STRIP AND APPARATUS THEREOF

摘要

PURPOSE: A singulation method of a BGA(Ball Grid Array) semiconductor package which is manufactured by a flexible circuit board strip and an apparatus thereof are provided to prevent the concentrated stress due to the impact of a singulation tool from being generated by sequentially pressing an upper portion of a resin molding part with the lower portion of the singulation tool. CONSTITUTION: Notch is formed at a flexible circuit board(20) and an epoxy both-sided adhesive tape(24) by using a punch(60), wherein the notch portion is adjacent to the lateral of a resin molding part(40). A single BGA semiconductor package is separated from a metal carrier frame(23) by pressing down the resin molding part(40) by using a singulation tool(70). At this time, the upper portion of the resin molding part(40) is sequentially pressed by the lower portion of the singulation tool(70), wherein the singulation tool(70) includes a sloped surface(71) on the lower portion thereof.