发明名称 Printed circuit board and electronic equipment using the board
摘要 An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.
申请公布号 US6480396(B2) 申请公布日期 2002.11.12
申请号 US20010803024 申请日期 2001.03.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NINOMIYA RYOJI
分类号 H05K1/18;H05K1/02;H05K1/11;H05K1/16;H05K3/28;H05K3/46;(IPC1-7):H05K7/02 主分类号 H05K1/18
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