发明名称 |
Printed circuit board and electronic equipment using the board |
摘要 |
An insulation layer is formed on a ground layer. The insulation layer includes first and second regions for forming wiring layers. The impedance of a wiring layer formed on the second region is lower than that of a wiring layer formed on the first region. A signal line pattern is formed on the wiring layer on the first region of the insulation layer. A power supply plane is formed on the wiring layer on the second region of the insulation layer in order to feed power to the signal line pattern through a termination resistor connected to the signal line pattern.
|
申请公布号 |
US6480396(B2) |
申请公布日期 |
2002.11.12 |
申请号 |
US20010803024 |
申请日期 |
2001.03.12 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NINOMIYA RYOJI |
分类号 |
H05K1/18;H05K1/02;H05K1/11;H05K1/16;H05K3/28;H05K3/46;(IPC1-7):H05K7/02 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|