Radiation-and/or heat-curable adhesive having high thermal conductivity

摘要

A radiation-and/or heat-curable adhesive with high thermal conductivity includes the following recipe:19 to 40 wt % of a difunctional acrylated, aromatic polyurethane;9 to 25 wt % of (2-hydroxypropyl) acrylate or methacrylate;1 to 5 wt % of one or more photoinitiators;35 to 70 wt % of one or more mineral fillers;0.5 to 3 wt. % of an SiO2-containing thixotropizing agent; and0.5 to 2 wt % of an organic peroxide.