发明名称 FILLING DEVICE AND FILLING METHOD OF LIQUID-FORM RESIN TO SYRINGE
摘要 PROBLEM TO BE SOLVED: To provide a filling device and a filling method for a liquid-form resin to a syringe by which the liquid-form resin of a high viscosity can be filled in the syringe by injecting, and the filling can be quickly performed in such a manner that the remaining liquid-form resin in injection nozzles may not be uneven. SOLUTION: This filling device is equipped with a vacuumized atmosphere chamber 13, a plurality of syringes 1 arranged in the vacuumized atmosphere chamber 13, a stock tank 14 in which the liquid-form resin 5 is stocked, and the injection nozzle 2. In this case, the injection nozzle 2 is connected with the stock tank 14 with a transfer hose 4, and at the same time, is arranged above the syringe 1 in the vacuumized atmosphere chamber 13. The injection nozzle 2 forms a linear resin transfer path 3 which connects a feeding port 6 for the liquid-form resin 5 which is formed at the upper end and a discharging port 7 which is formed at the lower end. At the same time, the injection nozzle 2 forms an air flowing-in path 8 which merges into the resin transfer path 3 from the side direction, and from which air to discharge the liquid-form resin 5 existing in the resin transfer path 3 under the merged section flows in.
申请公布号 JP2002326607(A) 申请公布日期 2002.11.12
申请号 JP20010128539 申请日期 2001.04.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HIMEJI JUNICHI
分类号 B65B3/14;B65B31/02;(IPC1-7):B65B31/02 主分类号 B65B3/14
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