发明名称 Method to pattern polysilicon gates with high-k material gate dielectric
摘要 A method of patterning a gate electrode layer having an underlying high-k dielectric layer comprising the following sequential steps. A substrate is provided. A high-k dielectric layer is formed over the substrate. A gate electrode layer is formed over the high-k dielectric layer. The gate electrode layer is patterned to form a patterned gate electrode layer, the patterned gate electrode layer having exposed side walls and a top. Sidewall spacers are formed over the exposed side walls of the patterned gate electrode layer, the sidewall spacers having tops. The patterned gate electrode layer is etched to pull the top of the patterned gate electrode layer down from the tops of the sidewall spacers. The exposed portions of the high-k dielectric layer not under the sidewall spacers and the pulled-down patterned gate electrode layer are removed.
申请公布号 US6479403(B1) 申请公布日期 2002.11.12
申请号 US20020085718 申请日期 2002.02.28
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 TSEI MING-HUAN;TAO HUN-JAN;PERNG BAW-CHING
分类号 H01L21/28;H01L21/336;H01L29/49;H01L29/51;(IPC1-7):H01L21/320 主分类号 H01L21/28
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