| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for mounting electronic parts capable of stably obtaining high heat resistance not generating foaming or peeling at the time of reflow of solder. SOLUTION: In manufacturing the substrate for mounting electronic parts by laminating two substrate materials different in adhesiveness for mounting electronic parts using a photosetting adhesive consisting of a thermoplastic resin, a cationic photo-polymerizable compound and a cationic photopolymerization initiator, an adhesive is applied to the substrate material lower in adhesiveness or an adhesive sheet is laminated thereto to form an adhesive layer and, after this adhesive layer is irradiated with light, this substrate material is laminated to the substrate material higher in adhesiveness. |
