发明名称 Electronic assembly and cooling thereof
摘要 An integrated circuit that includes a die having a circuit area and outer edges. A guard ring surrounds the circuit area within the outer edges of the die. The guard ring includes a projection that extends to at least one outer edge of the die to extract heat from the die that is generated during operation of the integrated circuit.
申请公布号 US6480385(B2) 申请公布日期 2002.11.12
申请号 US20010012994 申请日期 2001.12.10
申请人 INTEL CORPORATION 发明人 SESHAN KRISHNA
分类号 H01L23/467;H01L23/498;H05K1/02;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/467
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