| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier for polishing a glass substrate, and a glass substrate polishing device, capable of restricting generation of flaws in an outer circumferential edge surface of a disc-shaped glass substrate in a process of lapping a main surface. SOLUTION: A double-side lapping machine 20 comprises the carrier 27 provided with holes 28 for containing a glass substrate workpiece 30. In this carrier 27, a rate of a radius R of the hole 28 to a radius r of the glass substrate workpiece 30, that is a value of R/r, is set to be 1.030 or more. |
