发明名称 LEAVINGS REMOVING METHOD FOR STAMPING AND MANUFACTURING METHOD OF STAMPING ARTICLE
摘要 <p>PROBLEM TO BE SOLVED: To provide a leavings removing method capable of being easily performed even if a spot facing portion of a die is narrow, preventing leavings left in a hole portion formed by stamping, and improving yield of a product produced by stamping; and a manufacturing method of a stamping article including the leavings removing method; and to improve mounting technology of industrial parts, mainly electric equipment by providing, for example, a wiring substrate having a large number of small hole portions as a product. SOLUTION: In a die stamping method opening a hole portion on stamped material 3 by using a punch 10 and a die 12, after opening the hole portion on the stamped material 3 by the punch 10, the stamped material 3 is tightly contacted with a stripper 11 and lifted while the punch 10 is not extracted from the hole portion, and the punch 10 pulled up from the die 12 is returned so as to slightly project out of the lowest portion of the hole portion. In this state, leavings is removed.</p>
申请公布号 JP2002326194(A) 申请公布日期 2002.11.12
申请号 JP20010131225 申请日期 2001.04.27
申请人 NGK INSULATORS LTD 发明人 TAKEUCHI YUKIHISA;TSUJI HIROYUKI;KITAMURA KAZUMASA;YAMAGUCHI YOSHINORI
分类号 B26F1/00;B26F1/02;H05K3/00;H05K3/46;(IPC1-7):B26F1/02 主分类号 B26F1/00
代理机构 代理人
主权项
地址