Vialess printed circuit board

摘要

A method is disclosed for establishing signal contacts on a multilayer printed circuit board having alternating ground and signal layers in a stack-up configuration. The signal layers have signal pads and conductive traces leading away from the pads. The method comprises the steps of: a) drilling blind signal holes in the printed circuit board down to signal pads on successive signal layers, b) filling the blind signal holes with conductive material, and c) removing strips of the printed circuit board nearly down to successive signal layers to provide on each signal layer a strip of exposed signal contacts for the conductive traces thereon.