Semiconductor device having interconnected external electrode pads and wire bonding pads

摘要

A semiconductor device according to the invention of the present application includes a plurality of external electrode pads which are placed over the back of a substrate having a semiconductor chip mounted on the surface thereof, so as to be substantially parallel with the outer periphery of the substrate. A plurality of internal electrode pads respectively electrically connected to external electrodes via through holes defined in the substrate are formed over the surface of the substrate. The internal electrode pads are placed on the surface of the substrate, which corresponds to an area defined by areas in which the external electrode pads are formed and areas lying between the respective adjacent external electrode pads.Thus, the through holes can be defined in all the areas on the substrate except for the areas in which the external electrode pads are formed. The degree of freedom of the placement of the through holes defined in the substrate is improved accordingly.