发明名称 Low cure powder compositions for heat sensitive substrates
摘要 A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprisesa) from about 10-90% by weight, relative to a) plus b), of carboxylic acid functional acrylic resin(s);b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s);c) a first catalyst functioning as an epoxy homopolymerization catalyst; andd) a second catalyst functioning as an epoxy/carboxylic acid reaction catalyst.
申请公布号 US6479585(B2) 申请公布日期 2002.11.12
申请号 US20000579621 申请日期 2000.05.26
申请人 H. B. FULLER LICENSING & FINANCING INC. 发明人 HART STEPHEN C.;SCHMIERER JEFFREY G.;CARLSON BRIAN W.;LARSON STEPHEN C.
分类号 C08G59/18;C09D163/00;(IPC1-7):B32B21/08;B32B27/10;C08L33/02;C08L33/14;C08L63/00 主分类号 C08G59/18
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