发明名称 |
Low cure powder compositions for heat sensitive substrates |
摘要 |
A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprisesa) from about 10-90% by weight, relative to a) plus b), of carboxylic acid functional acrylic resin(s);b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s);c) a first catalyst functioning as an epoxy homopolymerization catalyst; andd) a second catalyst functioning as an epoxy/carboxylic acid reaction catalyst.
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申请公布号 |
US6479585(B2) |
申请公布日期 |
2002.11.12 |
申请号 |
US20000579621 |
申请日期 |
2000.05.26 |
申请人 |
H. B. FULLER LICENSING & FINANCING INC. |
发明人 |
HART STEPHEN C.;SCHMIERER JEFFREY G.;CARLSON BRIAN W.;LARSON STEPHEN C. |
分类号 |
C08G59/18;C09D163/00;(IPC1-7):B32B21/08;B32B27/10;C08L33/02;C08L33/14;C08L63/00 |
主分类号 |
C08G59/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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